| ITL | 公司名称 | 惠州市惠阳爱特电子有限公司 | 版本 | C | |
| 文件名称 | 制程能力Process capability | 页次 | 1/1 | ||
| 序号No. | 流程Technological process | 详述Detailed | 量产能力Production capacity | 样品及小批量能力Sample and small batch capacity | |
| 1 | 材料(Material) | 材料厚度公差(Material thickness tolerance) | 如无特别说明(If not specified)：±10% | 如无特别说明(If not specified)：±10% | |
| 2 | 层数(layers) | 软板(FPC) | 1-8 layers | 1-10 layers | |
| 软板盲埋孔 | 4层2阶 | 6层3阶 | |||
| 软硬板(Rigid-Flex) | 2-8 layers | 2-10 layers | |||
| 软硬结合盲埋孔 | 6层2阶 | 8层4阶 | |||
| 3 | 尺寸(size) | 最小产品尺寸(Minimum product size) | 3*15mm | 2*10mm | |
| 软板最大产品尺寸长度(Maximum product size) | ≤1200mm | ≤1200mm | |||
| 软硬结合板最大尺寸长度 | ≤600mm | ≤630mm | |||
| 4 | 开料(Material cutting) | 补强类开料精度(Cutting precision) | ±0.2mm | ±0.1mm | |
| 5 | 钻孔(Drilling) | 钻孔孔径公差(Aperture tolerance) | ±0.05mm | ±0.025mm | |
| 钻孔位置公差(Hole position tolerance) | ±0.05mm | ±0.05mm | |||
| 钻孔最小间距(孔边到边)(Minimum drilling distance(hole edge to hole edge)) | ≥0.10 mm | ≥0.1 mm | |||
| 内层孔到其它网络导体距离(The distance between the inner hole and other network conductor) | ≥0.20 mm | ≥0.15 mm | |||
| 最小激光钻孔(Minimum laser drilling) | 0.05mm | 0.04mm | |||
| 钻咀尺寸(Nozzle size) | 0.1mm～6.5mm | 0.1mm～6.5mm | |||
| 6 | 沉铜/板镀(copper deposition/copper plating) | 孔径纵横比（板厚比孔径，软硬结合板类）Aperture aspect ratio(thickness ratio aperture) | 10:1 | 12:1 | |
| 盲孔径纵横比 | 0.8:1 | 0.8:1 | |||
| 最小孔径(Minimum aperture) | ≥0.045mm | ≥0.045mm | |||
| 最大孔铜厚(Maximum thickness for hole copper) | 35um | 50um | |||
| 最小孔铜厚(Minimum thickness for hole copper) | ≥10um | ≥8um | |||
| 7 | 清洁(clean) | 最小磨板厚度(Minimum thickness of Polishing FPC) | ≥0.05mm | ≥0.05mm | |
| 最小洗板厚度(Minimum thickness of cleaning FPC) | ≥0.05mm | ≥0.05mm | |||
| 8 | 层压(Laminate) | 层间对位偏差(Deviation between layers) | ±0.05mm | ±0.05mm | |
| 9 | 曝光(exposure) | 图形对位公差(Graphic alignment tolerance) | 0.045mm | 0.03mm | |
| 多层板内层芯板对位公差 | ≤25um | ≤25um | |||
| 最小线宽/线距控制 | ≥0.04mm | ≥0.035mm | |||
| 10 | 蚀刻(Etching) | 最小线宽/线距控制(Minimum line width/space control) |
完成铜厚Complete copper thickness:12-18um W/S：2.0/2.0mil(线距大于2mil时，最小线宽可以做到1.3mil) |
完成铜厚Complete copper thickness:12-18um W/S：2.0/2.0mil(线距大于2mil时，最小线宽可以做到1.3mil) |
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完成铜厚18-35um W/S：4/4mil |
完成铜厚35um W/S：3/3mil |
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完成铜厚35-50um W/S：5/5mil |
完成铜厚50um W/S：4/4mil |
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完成铜厚50-70um W/S：7/7mil |
完成铜厚70um W/S：6/6mil |
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| 线宽线距公差(Tolerances for width and spacing) | ±0.015mm（线宽线距≥0.2mm±10%） | ±0.015mm（线宽线距≥0.2mm±10%） | |||
| 手指Pitch公差（首尾两PIN）(Finger Pitch tolerance ) |
0≤Pitch≤30mm ±0.05mm 30<Pitch≤50mm ±0.08mm 50<Pitch≤100mm ±0.12mm |
0≤Pitch≤30mm ±0.05mm 30<Pitch≤50mm ±0.08mm 50<Pitch≤100mm ±0.12mm |
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| 双面板过孔PAD最小孔环(Minimum ring of through hole) | ≥0.075mm | ≥0.075mm | |||
| 导体离外形或NPTH最小距离(The minimum distance between the conductor and the outline or NPTH) | ≥0.15mm | ≥0.10mm | |||
| 多层板内层过孔PAD最小孔环(The innermost layer of the multilayer FPC, the smallest hole PAD ring) | ≥0.1mm | ≥0.1mm | |||
| 蚀刻的铜条限位线边到外形距离公差（Tolerance of distance from edge of limit line of etched copper strip to outline） | ±0.12mm（外形模具冲切） | ±0.1mm（外形激光切割） | |||
| 11 | 冲孔Punching hole | 标准工具孔尺寸(Standard tool hole dimensions) | 2.0mm | 2.0mm or 3.0mm | |
| 工具孔位置公差(Tool hole position tolerance) | ±0.025mm | ±0.025mm | |||
| 工具孔大小公差 (Tool hole size tolerance) | ±0.025mm | ±0.025mm | |||
| 工具孔心到板边最小距离(The minimum distance from the center of the tool hole to the edge of the outline) | ≥5mm | ≥4mm | |||
| 12 | 贴合(Fit) | 覆盖膜累计公差（包括偏位、溢胶、尺寸公差等）(Cumulative tolerance of covering film (including deflection, overflow, size tolerance, etc.)) | 人工：±0.20mm,设备：±0.10mm | 人工：±0.15mm,设备：±0.10mm | |
| 最大溢胶量(Maximum overflow) | ≤0.1mm | ≤0.08mm | |||
| 覆盖膜不上PAD的最小距离(The minimum distance between the covering film and PAD) | ≥0.1mm | ≥0.08mm | |||
| 覆盖膜不露线或铜的最小距离(The minimum distance of the covering film to a line or copper) | ≥0.1mm | ≥0.1mm | |||
| 最小覆盖膜桥宽(Minimum covering membrane width) | ≥0.3mm | ≥0.3mm | |||
| 保护膜最小方形开窗(Minimum square window with covering film) | 0.5*0.5mm | 0.5*0.5mm(开精密模或激光) | |||
| 覆盖膜开窗与外形边距离公差(Covering film opening to edge tolerance) | ±0.20mm | ±0.15mm | |||
| 层间对位精度 | ≥0.075mm | ≥0.05mm | |||
| 13 | 板厚(FPC thickness) | FPC最小板厚(FPC minimum thickness) | 0.05+/-0.02mm | 0.05+/-0.02mm | |
| 软硬板(Rigid-Flex) | 2.6+/-10% mm | 2.8+/-10% mm | |||
| 14 | 表面处理(Surface treatment) | OSP | 有机保护膜（抗氧化处理） | ||
| 有铅喷锡（HASL）,仅对应软硬结合板 外发 | Sn：2um-40um | Sn：2um-40um | |||
| 无铅喷锡（HASL free），仅对应软硬结合板 外发 | Sn：2um-40um | Sn：2um-40um | |||
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镍钯金(ENEPIG) 外发(outward processing) |
Ni：1.0-6.0um Ba：0.10um Au：0.10um |
Ni：1.0-6.0um Ba：0.10um Au：0.10um |
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| 镀硬金(Hard gold plating) 外发(outward processing) | Ni：1.0-6.0um Au：0.02um-0.8um | Ni：1.0-6.0um Au：0.02um-2um | |||
| 镀软金(Soft gold plating) 外发(outward processing) | Ni：1.0-6.0um Au：0.02um-0.8um | Ni：1.0-6.0um Au：0.02um-1um | |||
| 镀软直金 | Au：0.02um-0.8um | Au：0.02um-1um | |||
| 沉镍金(ENIG) | Ni：120-200U＂ Au：2-4U＂ | Ni：120-200U＂ Au：2-4U＂ | |||
| 沉银(Immersion silver) 外发(outward processing) | Ag：0.1-0.3um | Ag：0.1-0.3um | |||
| 电镀锡(Tin plating) | 2um-15um | 2um-15um | |||
| 15 | PI 补强(PI stiffener) | 贴合公差 (Fit tolerance) | 人工：±0.15mm，设备：±0.1mm | 人工：±0.15mm，设备：±0.1mm | |
| 16 | FR4补强(FR4 stiffener) | 贴合公差 (Fit tolerance) | 人工：±0.15mm，设备：±0.1mm | 人工：±0.15mm，设备：±0.1mm | |
| 17 | 胶纸类( Adhesive tape) | 贴合公差 (Fit tolerance) | 人工：±0.3mm，设备：±0.15mm | 人工：±0.3mm，设备：±0.15mm | |
| 18 | 阻焊(Solder Mask) | 阻焊厚度(Solder thickness) | ≥15um | ≥15um | |
| 油墨颜色(Ink color) | 白/黑/黄/绿/红/蓝(White / black / yellow / green / red / blue) | ||||
| 油不上PAD的最小距离(Oil minimum distance on PAD) | ≥0.05mm | ≥0.04mm | |||
| 油不露线或铜的最小距离(The minimum distance of oil from lines or copper) | ≥0.05mm | ≥0.04mm | |||
| 最小阻焊桥(Minimum resistance welding Bridge) | 0.10mm | 0.10mm | |||
| 19 | 丝印(Screen printing) | 位置公差 (Position tolerance) | ±0.3mm（人工丝印） | ±0.2mm（喷墨） | |
| 油墨颜色(Ink color) | 白/黑色(White / black ) | 白(White ) | |||
| 最小丝印线宽(Minimum screen width) | ≥0.12mm | ≥0.075mm（喷墨） | |||
| 20 | 电测 |
飞针测试Pad/Putch(mm） |
0.1/0.2mm | 0.1/0.2mm | |
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四线专用测试机FOUR WIRE MILLI-RESISTANCE TESTER |
0.3mΩ-100Ω(精度Test Accuracy:±/0.3mΩ) | 0.3mΩ-100Ω(精度Test Accuracy:±/0.3mΩ) | |||
| 21 | 模具(Tool) | 精密模具公差（50万冲次以上）Tolerances for precision molds(500 thousand punching times) |
0<L≤100mm ±0.05mm 100mm<L ±0.05%mm |
样品外形以Laser为主，公差如下：The sample shape is Laser, the tolerance is as follows: 0<L≤150mm ±0.05mm 150mm<L ±0.05%mm |
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| 快走丝模具公差（10万冲次）Tolerances for quick die(100 thousand punching times) |
0<L≤50mm ±0.08mm 50<L≤100mm ±0.1mm 100mm<L ±0.125%mm |
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| 中走丝模具公差（20万冲次）Tolerances for medium wire die(200 thousand punching times) |
0<L≤50mm ±0.075mm 50<L≤100mm ±0.10mm 100mm<L ±0.1%mm |
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| 木刀模公差（5万冲次）Tolerances for wood knife dies(50 thousand punching times) |
0<L≤50mm ±0.20mm 50<L≤100mm ±0.25mm 100mm<L ±0.25%mm |
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| 蚀刻刀模公差（5万冲次）Tolerances for etching die(50 thousand punching times) |
0<L≤50mm ±0.10mm 50<L≤100mm ±0.125mm 100mm<L ±0.125%mm |
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| 冲穴大小(Punch size) | ≥0.5mm | 任意大小 | |||
| 外形尺寸公差 | 实际产品尺寸公差范围：无辅料的情况下最严可以按A级标准；有辅料（除开FR4补强）的情况下最严按B级标准；有FR4补强的外形尺寸按C级标准 |
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| 22 | 激光(Laser) | 激光外形公差(outline tolerance) | 公差tolerance：±0.05mm（L≤150mm） | 公差tolerance：±0.05mm（L≤150mm） | |
| 激光内穴公差(Laser inner slot tolerance) | 公差tolerance：±0.03mm | 公差tolerance：±0.03mm | |||
| 23 | 阻抗(Impedance) | 阻抗公差(Impedance tolerance) |
特性阻抗一般(Characteristic impedance)50Ω ±5Ω 差分阻抗一般(Differential impedance)100Ω ±10%Ω |
特性阻抗一般(Characteristic impedance)50Ω ±5Ω 差分阻抗一般(Differential impedance)100Ω ±10%Ω |
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| 24 | 插拔金手指偏位Gold finger displacement | 插拔金手指偏位公差Offset tolerance of gold finger | 慢走丝模具冲切最严The die of slow wire cutting is the most strict：±0.05mm | 激光切割最严Laser cutting is the most strict：±0.05mm | |
